MEMS Packaging Technologies and 3D Integration
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers...
| Format: | eBook |
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| Language: | English |
| Published: |
MDPI - Multidisciplinary Digital Publishing Institute
2022
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| Subjects: | |
| Online Access: | Open Access: DOAB: description of the publication Open Access: DOAB, download the publication |