Radiation effects in MIT Lincoln Lab 3DIC technology

by Gouker, Pascale M., Wyatt, Peter W., Yost, Donna-Ruth W., Chen, Chenson K., Chen, Chang-Lee, Knecht, Jeffrey M., Keast, Craig L.
Published 2010

Channel engineering of SOI MOSFETs for RF applications

by Keast, Craig L., Wyatt, Peter W., Healey, Paul D., Yost, Donna-Ruth W., Gouker, Pascale M., Chen, Chenson K., Kedzierski, Jakub T., Knecht, Jeffrey M., Chen, Chang-Lee
Published 2010

Wafer-scale 3D integration of silicon-on-insulator RF amplifiers

by Keast, Craig L., Chen, Chang-Lee, Chen, Chenson K., Yost, Donna-Ruth W., Knecht, Jeffrey M., Wyatt, Peter W., Burns, James A., Warner, Keith, Gouker, Pascale M., Healey, Paul D., Wheeler, Bruce D.
Published 2010

Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits

by Shaver, David C., Keast, Craig L., Wheeler, Bruce D., Hu, WeiLin, Bolkhovsky, Vladimir, Berger, Robert, Suntharalingam, Vyshnavi, Soares, Antonio M., Donnelly, Joseph P., Mahoney, Leonard J., Oakley, Douglas C., Chapman, David C., Knecht, Jeffrey M., Yost, Donna-Ruth W., Chen, Chang-Lee
Published 2010