Thermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structures

by Wang, Guotao
Published 2008

Positive solutions of the three-point boundary value problem for fractional-order differential equations with an advanced argument

by Ntouyas SK, Wang Guotao, Zhang Lihong
Published 2011-01-01

New Existence Results and Comparison Principles for Impulsive Integral Boundary Value Problem with Lower and Upper Solutions in Reversed Order

by Song Guangxing, Wang Guotao, Zhang Lihong
Published 2011-01-01

Numerical investigation of blade dynamic characteristics in an axial flow pump

by Zhang Desheng, Pan Dazhi, Xu Yan, Shao Peipei, Wang Guotao
Published 2013-01-01