The study of heat block thermal distribution to improve epoxy film de-lamination in wire bonding process

by Ting-jui Wu, 吳挺瑞
Published 2007

Development of Cu/Ag nanocomposite pastes for low-temperature low- pressure bonding

by Ting-Jui Wu, 吳庭睿
Published 2017

Rapid Atmospheric-Pressure-Plasma-Jet Processed Porous Materials for Energy Harvesting and Storage Devices

by Jian-Zhang Chen, Cheng-Che Hsu, Ching Wang, Wei-Yang Liao, Chih-Hung Wu, Ting-Jui Wu, Hsiao-Wei Liu, Haoming Chang, Shao-Tzu Lien, Hsin-Chieh Li, Chun-Ming Hsu, Peng-Kai Kao, Yao-Jhen Yang, I-Chun Cheng
Published 2015-01-01