Effects of Sterilization Cycles on PEEK for Medical Device Application

by Amit Kumar, Wai Teng Yap, Soo Leong Foo, Teck Kheng Lee
Published 2018-02-01

Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging

by Christopher Breach, Teck Kheng Lee, Wee Ling Eddy Chong, Chwee Sim Goh
Published 2013-07-01