Application of Endochronic Viscoplasticity with Cyclic Damage to Sn/3.5Ag/0.75Cu Solder Joint Specimens under Cyclic Proportional Displacement Path

by Tai-Kuang Lee, 李泰廣
Published 2007

Studies on Lead-free Piezoelectric Materials and Device based on Bismuth Layer and Perovskite Structure

by Tai-KuangLee, 李泰廣
Published 2016

A Study of Thin Film Resistors Prepared Using Ni-Cr-Si-Al-Ta High Entropy Alloy

by Ruei-Cheng Lin, Tai-Kuang Lee, Der-Ho Wu, Ying-Chieh Lee
Published 2015-01-01