Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

by Liang Zhang, Liang Zhang, Su-Juan Zhong
Published 2021-05-01

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

by Mu-lan Li, Liang Zhang, Nan Jiang, Lei Zhang, Su-juan Zhong
Published 2021-01-01

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

by Fan Yang, Liang Zhang, Zhi-quan Liu, Su-juan Zhong, Jia Ma, Li Bao
Published 2016-01-01

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

by Fan Yang, Liang Zhang, Zhi-quan Liu, Su Juan Zhong, Jia Ma, Li Bao
Published 2017-05-01

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

by Kai-Kai Xu, Liang Zhang, Li-Li Gao, Nan Jiang, Lei Zhang, Su-Juan Zhong
Published 2020-01-01