Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)

by Youjung Kim, Sanghyun Jin, Kimoon Park, Jinhyun Lee, Jae-Hong Lim, Bongyoung Yoo, Bongyoung Yoo, Bongyoung Yoo
Published 2020-10-01