Creep Behavior of a Sn-Ag-Bi Pb-Free Solder

by Alice Kilgo, Mark Grazier, Jerome Rejent, Paul Vianco
Published 2012-11-01

Equilibrium Cu-Ag nanoalloy structure formation revealed by in situ scanning transmission electron microscopy heating experiments

by Ping Lu, Michael Chandross, Timothy J. Boyle, Blythe G. Clark, Paul Vianco
Published 2014-02-01