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Muhammad Nubli Zulkifli
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Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS)
by
Rabiah Al Adawiyah Ab Rahim
,
Muhammad
Nubli
Zulkifli
,
Azman Jalar
,
Atiqah Mohd Afdzaluddin
,
Kim, Siow Shyong
Published 2020
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