Structure and properties of Sn-Cu lead-free solders in electronics packaging

by Meng Zhao, Liang Zhang, Zhi-Quan Liu, Ming-Yue Xiong, Lei Sun
Published 2019-12-01

Reliability issues of lead-free solder joints in electronic devices

by Nan Jiang, Liang Zhang, Zhi-Quan Liu, Lei Sun, Wei-Min Long, Peng He, Ming-Yue Xiong, Meng Zhao
Published 2019-12-01