Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications

by Michitaka Yamamoto, Ryu Karasawa, Shinji Okuda, Seiichi Takamatsu, Toshihiro Itoh
Published 2020-03-01

Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films

by Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi
Published 2019-02-01

Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding

by Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Seiichi Takamatsu, Toshihiro Itoh, Eiji Higurashi
Published 2020-04-01