The Reliability Improvement of Cu Interconnection by the Control of Crystallized α-Ta/TaNx Diffusion Barrier

by Wei-Lin Wang, Chia-Ti Wang, Wei-Chun Chen, Kuo-Tzu Peng, Ming-Hsin Yeh, Hsien-Chang Kuo, Hung-Ju Chien, Jen-Chi Chuang, Tzung-Hua Ying
Published 2015-01-01