The Sag Problem of Wire Bond in Multi-Chip and 3-Dimensional Semiconductor Packages

by Kung, Huang-Kuang, 鍾庚晃
Published 2009

Design of books inventory with RFID antenna in library management system

by Cheng Ching-Chien, Shih Sung-Tsun, Cheng Kong-Xin, Kung Huang-Kuang, Wang Chin-Yu
Published 2017-01-01

A compact low insertion loss bandpass filter based on meandered self-coupled ring resonator

by Cheng Ching-Chien, Cheng Kong-Xin, Kung Huang-Kuang, Wang Chin-Yu, Jeng Yng-Huey
Published 2017-01-01

An automatic energy-saving and thermal monitoring/controlling system for a pond

by Cheng Ching-Chien, Chiu Min-Chie, Chiu Che-Min, Kung Huang-Kuang, Wang Chin-Yu, Gao Zi-Jie
Published 2017-01-01

Application of Image Recognition Technique to Smart Golf Ball Picker

by LI, SHUN-LIANG, 李順良
Published 2018

An Innovative Way to Improve Wire Sag of Ultra-Long Wire Bonding Loops for 3D/MCM Packaging

by HSIEH, CHI-LUNG, 謝其龍
Published 2018

Wire Sag Study of Q-loop、S-loop and M-loop Bonds on Semiconductor Packaging

by Lee,Wen Hsuan, 李玟萱
Published 2014

Wire sweep analysis for the applications of Au,Cu and Pd-coated Cu wire in semiconductor wirebonding technology

by Li,Che-Chang, 李哲璋
Published 2012

Mismatch Study and Analysis of T-type Volar Plate and Distal Radius

by Wang,Yi Sian, 王譯賢
Published 2014

An Investigation on Dynamic Characteristics of A Hollow Tube

by Lin, Yang-Chen, 林揚程
Published 2013

Study of the enhanced performance on Organic Light Emitting Diodes by using Block Layer

by Lou, Heng, 樓亨
Published 2017

The analysis of wire sweep and wire sag based on molding flow analysis for 3-Dimensional and Multi-chip Modules semiconductor packaging

by HUNG,JIE-LIN, 洪傑麟
Published 2016