Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) Technology

by Aqeel Hussain Naqvi, Jeong-Heum Park, Chang-Wook Baek, Sungjoon Lim
Published 2020-01-01

V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology

by Aqeel Hussain Naqvi, Jeong-Heum Park, Chang-Wook Baek, Sungjoon Lim
Published 2019-01-01

Thermal Frequency Reconfigurable Electromagnetic Absorber Using Phase Change Material

by Heijun Jeong, Jeong-Heum Park, You-Hwan Moon, Chang-Wook Baek, Sungjoon Lim
Published 2018-10-01