Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures

by Roman Koleňák, Igor Kostolný
Published 2018-09-01

Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

by Roman Koleňák, Igor Kostolný
Published 2015-01-01

Fluxless ultrasonic soldering of SiC ceramics and Cu by Bi–Ag–Ti based solder

by Daniela Šuryová, Igor Kostolný, Roman Koleňák
Published 2020-03-01

ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS

by Roman Koleňák, Michal Prach, Igor Kostolný
Published 2016-04-01

Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

by Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Martin Sahul
Published 2021-12-01

Study of Zn6Al6Ag Alloy Application in Ultrasonic Soldering of Al₂O₃–(Al/Al₂O₃) Joints

by Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Matej Pasak
Published 2020-03-01

Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn–Al–Mg Solder

by Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Zackova, Marcel Kuruc
Published 2020-01-01

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

by Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Sahul, Ján Urminský
Published 2018-04-01

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

by Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Babincova, Peter Gogola
Published 2021-04-01

Characterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition

by Erika Hodulova, Ana S. Ramos, Roman Kolenak, Igor Kostolny, Beata Simekova, Ingrid Kovarikova
Published 2019-11-01