An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant

by Min-Jae Song, Kwon-Hee Kim, Gil-Sang Yoon, Hyung-Pil Park, Heung-Kyu Kim
Published 2014-05-01

A Study on the Void Formation in Residual Wall Thickness of Fluid-Assisted Injection Molding Parts

by Hyung-Pil Park, Baeg-Soon Cha, Soo-Bin Park, Jae-Hyuk Choi, Dong-Han Kim, Byung-Ohk Rhee, Kye-Hwan Lee
Published 2014-01-01