Investigation of TSV Liner Interface With Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC

by Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka
Published 2019-01-01

Generation of STDP With Non-Volatile Tunnel-FET Memory for Large-Scale and Low-Power Spiking Neural Networks

by Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Published 2020-01-01

The Effect of Tungsten Volume on Residual Stress and Cell Characteristics in MONOS

by Young-Taek Oh, Jae-Min Sim, Hisashi Kino, Deok-Kee Kim, Tetsu Tanaka, Yun-Heub Song
Published 2019-01-01

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

by Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Published 2016-10-01