Effect of isothermal aging on the microstructure, shear behavior and hardness of the Sn58Bi/Sn3.0Ag0.5Cu/Cu solder joints

by Ruisheng Xu, Yang Liu, Fenglian Sun
Published 2019-12-01

Interfacial reaction, microstructure and mechanical properties of Sn58Bi solder joints on graphene-coated Cu substrate

by Yang Liu, Shengli Li, Wei Song, Xuan Wang, Hao Zhang, Fenglian Sun
Published 2019-06-01

Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

by Hao Zhang, Yang Liu, Lingen Wang, Fenglian Sun, Xuejun Fan, Guoqi Zhang
Published 2019-03-01

Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

by Shengli Li, Yang Liu, Hao Zhang, Hongming Cai, Fenglian Sun, Guoqi Zhang
Published 2018-12-01