Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach

by M.S. Abdul Aziz, M. Z. Abdullah, C.Y. Khor, F. Che Ani, N.H. Adam
Published 2016-01-01

Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

by M. A. Fatah M. Mukhtar, A. Abas, M. S. Haslinda, F. Che Ani, A. Jalar, A. A. Saad, M. Z. Abdullah, R. Ismail
Published 2019-01-01