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Dipak Sengupta
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Dipak Sengupta
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A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications
by
Shuai Shao
,
Dapeng Liu
,
Yuling Niu
,
Kathy O’Donnell
,
Dipak
Sengupta
,
Seungbae Park
Published 2017-02-01
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