Génération de modeles compacts thermiques dynamiques de composants electroniques via les algorithmes genetiques

by Dia, Cheikh Tidiane
Published 2015

Analytical thermal modelling of multilayered active embedded chips into high density electronic board

by Monier-Vinard Eric, Laraqi Najib, Dia Cheikh Tidiane, Nguyen Minh Nhat, Bissuel Valentin
Published 2013-01-01

Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

by Monier-Vinard Eric, Laraqi Najib, Dia Cheikh Tidiane, Nguyen Minh-Nhat, Bissuel Valentin
Published 2016-01-01