InGaAs FinFETs 3-D Sequentially Integrated on FDSOI Si CMOS With Record Performance

by C. Convertino, C. B. Zota, D. Caimi, M. Sousa, L. Czornomaz
Published 2019-01-01

Towards large size substrates for III-V co-integration made by direct wafer bonding on Si

by N. Daix, E. Uccelli, L. Czornomaz, D. Caimi, C. Rossel, M. Sousa, H. Siegwart, C. Marchiori, J. M. Hartmann, K.-T. Shiu, C.-W. Cheng, M. Krishnan, M. Lofaro, M. Kobayashi, D. Sadana, J. Fompeyrine
Published 2014-08-01