The Study Of Delaminating At Interface Between Molding Compound And Gold Substrate Bond Pad In BGA(Ball Grid Array) Package

by Chin-chung Hsieh, 謝清俊
Published 2010

The impacts of strategic purchaser’s social capital on sourcing performance – the case of electrical industry.

by Chin-Chung Hsieh, 謝錦鐘
Published 2005

Dynamic Traffic Adjustment for End-to-End Proportional Differentiated Services on MPLS Networks

by Chin-Chung Hsieh, 謝進忠
Published 2004

Design Methods of Reinforced Earth Embankments Reinforced by Soil Nails

by Chin-Chung Hsieh, 謝至忠
Published 2007