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胡應強
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胡應強
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胡應強
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1
Electromigration Induced Microstructure change in Flip Chip Solders Joint and Tin Stripe
by
Ying-Chiang Hu
,
胡
應
強
Published 2004
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2
A Study on Thermal Performance of Open Cell Rigid Polyurethance Foam Vacuum Insulation Panel System
by
Hu, Ying-Ch''ang
,
胡
應
強
Published 1997
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