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Busek, D.
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Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment
by
Busek
,
D
.
,
Codreanu, N.
,
Géczy, A.
,
Illés, B.
,
Straubinger, D.
Published 2022
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Related Subjects
Electronics manufacturing
Geometry
Geometry variations
Heat transfer
Heat transfer methods
Hotspot temperature
Hottest-spot temperatures
Manufacturing environments
Modeling approach
Reflow--soldering
Smart electronics
Soldering
Thermocouples
Vapor-phase soldering
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