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5by Kirkham, F.J, Wade, A.M, McElduff, F., Boyd, S.G, Tasker, R.C, Edwards, M., Neville, B.G, Peshu, N., Newton, C.RGet fulltext
Published 2012
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6Experimental study of the residual stress-induced self-assembly of MEMS structures during depositionby Kim, Sang-HyunOther Authors: “...Boyd, James G....”
Published 2005
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8by Lee, Jae SangOther Authors: “...Boyd, James G....”
Published 2010
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11by Drummond, Franklin JerrelOther Authors: “...Boyd, James G....”
Published 2011
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