Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach

by Hiroaki Tatsumi, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Published 2019-08-01

Bonding through novel solder-metallic mesh composite design

by Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Published 2018-12-01

Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints

by Takahito Fushimi, Yo Tanaka, Shinnosuke Soda, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
Published 2019-04-01

Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging

by Hiroaki Tatsumi, Adrian Lis, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Published 2019-01-01

Fracture behavior of thermally aged Ag–Cu composite sinter joint through microscale tensile test coupled with nano X-ray computed tomography

by Tomoki Matsuda, Seigo Yamada, Akihisa Takeuchi, Kentaro Uesugi, Masahiro Yasutake, Tomokazu Sano, Mitsuru Ohata, Akio Hirose
Published 2021-08-01

Improving Fatigue Performance of Laser-Welded 2024-T3 Aluminum Alloy Using Dry Laser Peening

by Tomokazu Sano, Takayuki Eimura, Akio Hirose, Yosuke Kawahito, Seiji Katayama, Kazuto Arakawa, Kiyotaka Masaki, Ayumi Shiro, Takahisa Shobu, Yuji Sano
Published 2019-11-01