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施伯錚
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施伯錚
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施伯錚
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1
Interfacial Bonding Behavior between Sn-Ag-Cu Series Lead-free Solders and Cu/Ni-P/Au Substrate
by
Po-Cheng Shih
,
施
伯
錚
Published 2003
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2
Investigations on the Interfacial Reaction, Shear and Electrical Properties of Sn-Ag-Cu Solder Joints with Sn-Zn-Bi Paste Addition
by
Po-Cheng Shih
,
施
伯
錚
Published 2006
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