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163“... temperature of the chip (Tj ) from thermal circuit law. Furthermore, from FEM result of LED with printed...”
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164“... of chip, package, and board are separate from each other. However, the lack of information from other...”
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165by Berringer, Molly A“... of ICs, traditional implant packaging become a limiting factor on implant miniaturization. Additionally...”
Published 2018
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166by 古建元“... that influence the packaging quality. The reflow oven provides heat sources to bond components and print circuit...”
Published 2007
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168by Cheng, Karen,S.M.Massachusetts Institute of Technology.“... (pages 61-65). === Packaging plays an essential role in protecting a product from damage, attracting...”
Published 2019
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169“.... This study is discussing different packaging material would change the efficiency of solar modules...”
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170by Liu, Ting-Hung“... printed package that serves as the housing for the completed sensor assembly. The C-V measurement...”
Published 2018
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171by Sharma, Sanjay“...The traditional design of printed circuit board assembly focuses on finding a set of parameter...”
Published 2014
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173“...The printing process is increasing and spreading as a result of the emergence of modern trends...”
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174“...The pharmaceutical packaging with engraved Braille is commonly used today. The paper presents...”
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176by Paramasivam Parimalam, Raghavan Premalatha, Srinivasan Padmini, Kumar GanguliSubjects: “...printing...”
Published 2010-01-01
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177“...). === Increasing the pace of product innovation in the consumer packaged goods industry can be achieved...”
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178by Max Eickenscheidt, Michael Langenmair, Ahmad Dbouk, Dorit Nötzel, Thomas Hanemann, Thomas Stieglitz“...Ceramics are repeatedly investigated as packaging materials because of their gas tightness, e.g...”
Published 2021-01-01
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179“...碩士 === 國立臺灣科技大學 === 設計研究所 === 98 === Printing is generally called an integrated industry for its...”
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