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  1. 121
    The study on the form of reused package from the view of consumers-the package of bride cakes as example.
    “.... Regarding to the design about Decoration and Graphics, consumers prefer saving those packages with printed...”
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  2. 122
    Analysis of Print and Electronic Serials’ Use Statistics Facilitates Print Cancellation Decisions
    by Pamela Haley
    Published 2006-12-01
    “...: Utilizing Data From All Available Sources to Make Judicious Print Cancellation Decisions.” Library...”
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    Article
  3. 123
    Devising a procedure for examining the quality of prints of digital and offset printing on corrugated cardboard
    by Svitlana Khadzhynova, Svitlana Havenko
    Published 2020-10-01
    Subjects: “...digital and offset printing...”
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    Article
  4. 124
    Research on Packages and PCB Codesign
    by Guo-Chang Tzeng, 曾國昌
    Published 2001
    “... (BGA) and Pin Grid Array (PGA) packages increase, the routing of a Printed-Circuit-Board (PCB) becomes...”
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  5. 125
    Packaging Design for Implantable Biomicrosystem
    by Chi-Chan K. Hung, 洪基展
    Published 2003
    “... the Surface Mount Devices (SMDs) components on Printed Circuit Board (PCB) and stimulating electrodes...”
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  6. 126
    Analysis on the Characteristics of IC Package
    by Ching-Liang Tsai, 蔡金良
    Published 2001
    “... is divided by 1.Chip. 2.Assembly, i.e. package. 3. PCB (Printed Circuit Board). Analizing the electrical...”
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  7. 127
    MEMS Packaging Technologies and 3D Integration
    Published 2022
    Subjects: “...biocompatible packaging...”
    Open Access: DOAB: description of the publication
    Open Access: DOAB, download the publication
    eBook
  8. 128
    Improvement in Thermochromic Offset Print UV Stability by Applying PCL Nanocomposite Coatings
    Subjects: “...Smart Packaging...”
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    Article
  9. 129
    Low-Cost Microwave Components’ Fabrication in Hybrid Technology of Laminates and Additive Manufacturing on an Example of Miniaturized Suspended Directional Coupler
    by Jakub Sorocki, Ilona Piekarz
    Published 2020-01-01
    Subjects: “...3D printing...”
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    Article
  10. 130
    Directly Printed Hollow Connectors for Microfluidic Interconnection with UV-Assisted Coaxial 3D Printing
    Subjects: “...3D printing...”
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    Article
  11. 131
    Prospects and Challenges of Functional Printing
    “... for printed energy storage devices, packages with RFID functionality, printed membranes and micro sieves...”
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  12. 132
    Prospects and Challenges of Functional Printing
    “... for printed energy storage devices, packages with RFID functionality, printed membranes and micro sieves...”
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  13. 133
    Optimal Dummy Pattern Design Method for PWB Warpage Control Using the Human-Based Genetic Algorithm
    by Sun Kyoung Kim, Sang-Hyuk Lee
    Published 2020-08-01
    Subjects: “...printed wiring board (PWB)...”
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    Article
  14. 134
    Advances in Packaging Methods, Processes and Systems
    by Nitaigour Premchand Mahalik
    Published 2014-10-01
    Subjects: “...packaging...”
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    Article
  15. 135
    ODEPAKK : an ordinary differential equations package
    by Shellenberger, John W.
    Published 2011
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  16. 136
    Thermal Strain Measurement of Electronic Packages
    by 姜亦震
    Published 1997
    “... levels of electronic package products will cause fatigue failures of thecomponents. 　　This thesis uses...”
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  17. 137
    Improved Subset Autoregression: With R Package
    by A. I. McLeod, Ying Zhang
    Published 2008-07-01
    “...The FitAR R (R Development Core Team 2008) package that is available on the Comprehensive R Archive...”
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    Article
  18. 138
    Electrical effects of CMOS circuit packaging
    by Zell, Christopher William
    Published 1996
    “... to quickly look at where he/she is going, and determine if there are any potential packaging related problems...”
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  19. 139
    Visual identification by computer vision-chip inductor multilayer printing process of printing graphics defect technology
    by Hsiu-Ming Hsu, 許修銘
    Published 2011
    “... industries covered by the semiconductor IC, IC packaging and testing, printed circuit, SMT surface mount...”
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  20. 140
    Inorganic Printed LEDs for Wearable Technology
    Subjects: “...printed electronics...”
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    Article
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