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  1. 81
    Additively Manufactured On-Package Multipolar Antenna Systems for Harsh Communication Channels
    by Ramirez-Hernandez, Ramiro A.
    Published 2018
    Subjects: “...3-D Printing...”
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  2. 82
    Development of 3-D Printed Hybrid Packaging for GaAs-MEMS Oscillators based on Piezoelectrically-Transduced ZnO-on-SOI Micromechanical Resonators
    by Lan, Di
    Published 2018
    “... is rigorously investigated within a few oscillator designs. At last, 3-D printed hybrid packaging using additive...”
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  3. 83
    The Study of the Optimal Parameter Design for Lead-free BGA Packages Rework Reflow Soldering Process by Manual Print Solder Paste Technology
    by LU WEI EN, 呂偉恩
    Published 2008
    “...) attaches importance to package and assembly in the electronics industry. A larger number of the researches...”
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  4. 84
    Correlation Among Marketing Information Management, Marketing Information Power, Effectiveness of Marketing Information Management, and Market Performance – Print and Packaging Industry
    by Wu-Chao Lee, 李武釗
    Published 2005
    “... competition and rapidly changing customer demands require the print and packaging industry to constantly...”
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  5. 85
    Package and PCB Effects Shift Intermodulation Notch in an RF Common-Emitter Amplifier
    by J.-M. Wu, M.-Y. Ko
    Published 2014-04-01
    Subjects: “...Package and printed circuit board (PCB) effects...”
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    Article
  6. 86
    Smart Card Packaging Process Control System
    by Siddiqi, Saad Ahmed
    Published 2012
    Subjects: “...SIM card packaging process...”
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  7. 87
    Novel RF MEMS Switch and Packaging Concepts
    by Oberhammer, Joachim
    Published 2004
    Subjects: “...0-level packaging...”
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    Doctoral Thesis
  8. 88
    Thermomechanical characterization of materials formicrominiaturized system board requirements
    by Bansal, Shubhra
    Published 2007
    Subjects: “...Printed circuits Materials...”
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  9. 89
    3D-Printable Nanocellulose-Based Functional Materials: Fundamentals and Applications
    Subjects: “...3D printing...”
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    Article
  10. 90
    The Influences of Plate Thickness、Printing Pressure、Printing Speed on Flexography Printing Quality
    “...碩士 === 國立臺灣藝術大學 === 應用媒體藝術研究所 === 95 === Packaging printing has two major functions which...”
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  11. 91
    An automatic detection method of ball grid array packaging chip welding based on X-ray image
    by FENG Chenyue, HUANG Hui, MA Yan
    Published 2021-08-01
    Subjects: “...printed circuit board(pcb)...”
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    Article
  12. 92
    Ultra-thin Ceramic Films for Low-temperature Temperature Embedding of Decoupling Capacitors into Organic Printed Wiring Boards
    by Balaraman, Devarajan
    Published 2006
    Subjects: “...Organic packages...”
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  13. 93
    Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters
    Subjects: “...power semiconductor packaging 1...”
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    Article
  14. 94
    Application of Package On Package Technology on BGA Rework Process
    by Wang, Szu-Po, 王思博
    Published 2011
    “... is during BGA rework process, it needs manually printing solder paste. However, after printing, solder paste...”
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  15. 95
    The best printing methods to print satellite images
    by G.A. Yousif, R.Sh. Mohamed
    Published 2011-12-01
    “...Printing systems operate in general as a system of color its color scale is limited as compared...”
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    Article
  16. 96
    Food Packaging. Materials and Technologies
    Published 2019
    Subjects: “...3D printing...”
    Open Access: DOAB: description of the publication
    Open Access: DOAB, download the publication
    eBook
  17. 97
    Using the technology of separating the seven colors (Prinect) as a substitute for Pantone colors in the printing and packaging industry for its economy and improving the quality of the Final publication
    by Hager ِAhmed Fahmin
    Published 2020-11-01
    “...The printing, packaging and packaging industry is one of the leading industries on which many...”
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    Article
  18. 98
    Absorption non-uniformity characterisation and its impact on flexographic ink distribution of coated packaging boards
    by Thorman, Sofia
    Published 2015
    Subjects: “...Print Mottle...”
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  19. 99
    [en] THE PRINCIPLE OF POSTPONEMENT: A STUDY AT THE SUPPLY CHAIN OF PRINTING INKS
    by PATRICIA ALCANTARA CARDOSO
    Published 2003
    Subjects: “...[en] PRINTING INKS...”
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  20. 100
    Package+Body
    by DE SIMAS MARTINS, MIGUEL
    Published 2014
    Subjects: “...packaging...”
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    Others
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