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181by Hakimi Tehrani, Ardeshir“...The aim of present research was design and optimization of printed spiral inductor coils...”
Published 2015
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183“... that fuel the IoT are getting smaller and cheaper all the time. So we propose a simple, low cost and printed...”
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184by Андрій Олегович Закревський, Ярослав Сергійович Козей, Віталій Вікторович Cухов“... the possibility of 3D printing of the resulting structure. The tasks to be solved are: based on the results...”
Published 2018-06-01
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185by Vanderpuije, Curtis N“.... === Includes bibliographical references (leaf 57). === The demand for printing excellent quality images has...”
Published 2007
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186by Mahdi Bodaghi, Reza Noroozi, Ali Zolfagharian, Mohamad Fotouhi, Saeed NorouziSubjects: “...4D printing...”
Published 2019-04-01
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187“... package - under the conditions of accelerated ageing with increased temperature and relative humidity...”
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188by Kiani, Sepehr“.... Products that may benefit from multi-connection vias include by-pass capatrs, IC packages, test probes...”
Published 2005
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189by Lawrie, Katherine Mary“... indicator, printable by flexo printing, resulted. The indicator is readily photobleached and recovery times...”
Published 2012
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190by Pugh, Simon“... to be present only in very small amounts in a packaging material to cause a taint problem. Typically, taints...”
Published 1998
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191by Jung Seok Kim, Jae Myung Cha, Min Seob Kwak, Jin Young Yoon, Jung Won Jeon, Hyun Phil Shin, Kwang Ro Joo, Joung Il Lee, Hye Young Kim“...With an increased use of the press-through package (PTP) tablet, there has also been an increase...”
Published 2017-11-01
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194by Siebert, Wolfgang Peter“... packaging towards the needs of high frequency applications. As the field of electronic packaging stretches...”
Published 2005
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Doctoral Thesis -
195“... the designs of chips as well as packages and printed circuit boards. Further, due to higher functionality...”
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196“...-intern (PrInt) students. The aim of this study was to evaluate the intern preparation package...”
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197“... weight and high density of electronic products， the traditional single chip package has no longer met...”
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198“... annealing (ASA) and the commercial finite element package ANSYS are combined to inverse the structural...”
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200“... performance and integrated functions but with smaller dimensions. This has forced the packaging technology...”
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