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  1. 141
    Novel conductive adhesives for electronic packaging applications: a way towards economical, highly conductive, low temperature and flexible interconnects
    by Zhang, Rongwei
    Published 2011
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  2. 142
    Three-Dimensional Package Design for Electro-Absorption Modulation Laser Array
    Subjects: “...three-dimension package...”
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    Article
  3. 143
    Physical Design of Optoelectronic System-on-a-Chip/Package Using Electrical and Optical Interconnects: CAD Tools and Algorithms
    by Seo, Chung-Seok
    Published 2005
    Subjects: “...Application specific integrated circuits Design and construction...”
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    Others
  4. 144
    INTEGRATED CIRCUITS TIMING ANALYSIS WITH ACCOUNT OF PAD MODELS AND BOND WIRES
    Subjects: “...integrated circuits...”
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    Article
  5. 145
    Semiconductor Packaging : Materials Interaction and Reliability
    by Chen, Andrea
    Published 2012
    Subjects: “...Circuits & components bicssc...”
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    eBook
  6. 146
    Development and Washing Reliability Testing of a Stretchable Circuit on Knit Fabric
    Subjects: “...packaging...”
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    Article
  7. 147
    Power Integrity and Electromagnetic Compatibility Design for High-speed Computer Package
    by Sin-Ting Chen, 陳信廷
    Published 2006
    “... of the simultaneous switching noise (SSN) problems in the power delivery networks (PDN) of high-speed digital circuit...”
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  8. 148
    Implementation of packaged integrated antenna with embedded front end for Bluetooth applications
    by Rotaru, Mihai
    Published 2008
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    Article
  9. 149
    Thermal and Optical Characterization of Photonic Integrated Circuits by Thermoreflectance Microscopy
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    Article
  10. 150
    The Practical Research of Battery Protection Integrated Circuit Testing System
    by Chien-Ying Chu, 朱劍英
    Published 2013
    “... reduce the packaging costs and make sure that the products conform to the specifications of the client...”
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  11. 151
    Edge Couplers in Silicon Photonic Integrated Circuits: A Review
    by Xin Mu, Sailong Wu, Lirong Cheng, H.Y. Fu
    Published 2020-02-01
    “... fabrication process. Optical interconnects is an important issue in silicon photonic integrated circuits...”
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    Article
  12. 152
    III-V Photonic Integrated Circuit for Fiber Optic Gyroscope
    by Yen-chieh Wang, 王彥傑
    Published 2016
    “.... This FOG photonic integrated circuit (PIC) is designed based on Smart Photonics InP/InGaAsP generic...”
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    Others
  13. 153
    Compact waveguide grating couplers for silicon photonic integrated circuits.
    Published 2010
    Subjects: “...Integrated circuits...”
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    Others
  14. 154
    Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor
    by 陳君瑜
    Published 2014
    “..., these additions increase packaging volume, integral complexity and cost. To address the above problems, a silicon...”
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    Others
  15. 155
    Systems Integration for Biosensing: Design, Fabrication, and Packaging of Microelectronics, Sensors, and Microfluidics
    Published 2012
    Subjects: “...Packaging...”
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    Doctoral Thesis
  16. 156
    A Study of Electromagnetic Interference Effects on CMOS Integrated Circuits
    by Lu Wen-Chao, 呂文超
    Published 1998
    “.... Besides, the effects of EMI and package on device behavior are studied by using the SPICE software.It...”
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    Others
  17. 157
    Extraction Based Verification Method For Off The Shelf Integrated Circuits
    by Nagubadi, Vivek
    Published 2010
    Subjects: “...CIRCUITS...”
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  18. 158
    Reliability Verification and Improvement of High Voltage Integrated Circuit (HVIC)
    by Tseng, Su-Peng, 曾恕鵬
    Published 2010
    “...碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 99 === Abstract High Voltage Integrated Circuit (HVIC...”
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    Others
  19. 159
    Improving the Test Methods for Radio-Frequency Switch Integrated Circuits
    by LIN, MING-WEI, 林明葦
    Published 2016
    “..., the more the categories and capabilities of 3C electronic products have, the more complicate the circuit...”
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    Others
  20. 160
    Application of effective medium theory to the analysis of integrated circuit interconnects
    by Holik, Sonia Maria
    Published 2010
    “...The design and physical verification of contemporary integrated circuits is a challenging task due...”
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