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  1. 101
    3D MICROPACKAGING OF INTEGRATED CIRCUITS
    by Băjenescu, Titu-Marius I.
    Published 2020-03-01
    “... some actual problems and reliability challenges in 3D IC packaging technology. It shows how different...”
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    Article
  2. 102
    Modeling of Simultaneous Switching Noise in On-Chip and Package Power Distribution Networks Using Conformal Mapping, Finite Difference Time Domain and Cavity Resonator Methods
    by Mao, Jifeng
    Published 2005
    Subjects: “...Three dimensional integrated circuits...”
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  3. 103
    Discrete Integrated Circuit Electronics (DICE)
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    Article
  4. 104
    The model of temperature distribution in integrated circuits
    by Jei-feng Hwang, 黃志豐
    Published 1995
    “...碩士 === 國立清華大學 === 電機工程研究所 === 83 === The design of power integrated circuits (PIC) is strongly...”
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  5. 105
    Design and fabrication of free-standing structures as off-chip interconnects for microsystems packaging
    by Kacker, Karan
    Published 2009
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  6. 106
    Semiconductor Packaging Materials Interaction and Reliability
    Published 2012
    Subjects: “...Circuits & components bicssc...”
    Open Access: DOAB: description of the publication
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    eBook
  7. 107
    Development of microfluidic packages on multilayer organic substrate for cooling and tuning RF circuits
    by Lemtiri Chlieh, Outmane
    Published 2016
    Subjects: “...RF packaging...”
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  8. 108
    Méthode de modélisation prédictive de boîtiers des circuits intégrés en vue d’anticiper avant design l’immunité au bruit du circuit
    by Bouchaala, Afef
    Published 2016
    Subjects: “...Virtual package prototyping...”
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  9. 109
    A Study of the Protection of Intellectual Property Rights of Circuit Layouts of Integrated Circuits
    by Fan Rung Jung, 范容榕
    Published 2015
    “... the integrated circuit foundries of Taiwan and the packaging and testing of integrated circuit industry in Taiwan...”
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  10. 110
    Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics
    Subjects: “...Hybrid integrated circuits...”
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    Article
  11. 111
    3D Integrated Circuit Cooling with Microfluidics
    by Shaoxi Wang, Yue Yin, Chenxia Hu, Pouya Rezai
    Published 2018-06-01
    Subjects: “...integrated circuits...”
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    Article
  12. 112
    Subsurface optical microscopy of semiconductor integrated circuits
    by Yurt, Abdulkadir
    Published 2015
    “...Thesis (Ph.D.)--Boston University === The semiconductor industry continues to scale integrated...”
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  13. 113
    Design methodologies for variation-aware integrated circuits
    by Samanta, Rupak
    Published 2010
    “... of operation and excessive leakage power. Moreover, the circuits are usually over-designed to compensate...”
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  14. 114
    Integrated Capacity Planning for IC Packaging and Final Test
    by Cheng-Ju Sun, 孫正儒
    Published 2010
    “... and capability of machines as well as the capacity of kits is developed for integrated circuit (IC) packaging...”
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  15. 115
    An Integrated Resistance Welding and TSV Process for Microsystems Packaging
    by Lien, Jui-Chien, 練瑞虔
    Published 2011
    “... for integrated circuits (IC) and microelectromechanical system (MEMS) devices. In this method, two wafers were...”
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  16. 116
    Integrated optoelectronics applications in fiber optic receiver packaging
    by Addington, J. Shawn
    Published 2014
    Subjects: “...packaging...”
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  17. 117
    Simulation of interconnections in high-speed integrated circuits
    by Parker, Bruce Howard
    Published 1994
    “... of choosing the correct impedances for both the lines and devices within the integrated circuit package...”
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  18. 118
    CMOS Technology Applied to Microwave Integrated Circuits
    by 周美芬
    Published 2005
    “..., circuit behaviors, schematic designs to package models as well as multi-process integration. Direct...”
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  19. 119
    Implementation of An Automatic Integrated Circuit Detection System
    by Jen-Nan Lo, 羅仁南
    Published 2005
    “... detection mode of I/O port in this thesis and it can be used for the IC package processing. This mode...”
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  20. 120
    Impacts of Noise on the CMOS RF Integrated Circuits
    by Meng-Ting Hsu, 許孟庭
    Published 2004
    “... and property of the device. And how noise applied to design the RF circuits. First, the noise figure to LNA...”
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