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Showing 21 - 40 results of 1,507 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.81s Refine Results
  1. 21
    An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection
    by Pouria Aryan, Santhakumar Sampath, Hoon Sohn
    Published 2018-06-01
    Subjects: “...IC packaging...”
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    Article
  2. 22
    Physical Design Automation for System-on-Packages and 3D-Integrated Circuits
    by Minz, Jacob Rajkumar
    Published 2007
    Subjects: “...Integrated circuits Large scale integration...”
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    Others
  3. 23
    Wideband characterization of wire bond interconnects for microwave integrated circuit packaging
    by Sutono, Albert
    Published 2007
    Subjects: “...Wire bonding (Electronic packaging)...”
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    Others
  4. 24
    Substrate Circuit Module Development and Signal-Integrity Improvement for System in Packaging
    by Kao-Yi Wang, 王高義
    Published 2011
    “... density interconnection become more popular. Single layer substrate has not afforded the complex circuit...”
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    Others
  5. 25
    Failure Analysis of Integrated Circuits Contaminated by Metal Particles in Package Process
    by 楊翔麟
    Published 2009
    “... in the integrated circuit (IC), the choice of lead-frame material and the contamination in mixing molding compound...”
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    Others
  6. 26
    Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing
    Published 2018
    Subjects: “...Packaging...”
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    Doctoral Thesis
  7. 27
    Helix-type compliant off-chip interconnect for microelectronic packaging
    by Zhu, Qi
    Published 2007
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  8. 28
    Current Status of the Integrated Circuit Industry in China ― Packaging and Testing Industry Review
    by Litho World
    Published 2019-12-01
    Subjects: “...packaging...”
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    Article
  9. 29
    Thermal characterization of VLSI packaging
    by Shope, David Allen, 1958-
    Published 1988
    Subjects: “...Integrated circuits -- Very large scale integration -- Thermal properties....”
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  10. 30
    Study on adhesion of underfill materials for flip chip packaging
    by Luo, Shijian
    Published 2006
    Subjects: “...Integrated circuits Reliability...”
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    Others
  11. 31
    CONDUCTIVE AND INDUCTIVE CROSSTALK COUPLING IN VLSI PACKAGES
    by Voranantakul, Suwan, 1962-
    Published 1986
    Subjects: “...Integrated circuits -- Very large scale integration....”
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  12. 32
    Study on thermally reworkable underfills for flip chip, BGA, and CSP applications
    by Wang, Lejun
    Published 2008
    Subjects: “...Integrated circuits...”
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  13. 33
    Development of fabrication process for integrated-circuit package using cooper as the bonding material
    by Yao-Ching Tsai, 蔡耀慶
    Published 2015
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    Others
  14. 34
    Fast methods for full-wave electromagnetic simulations of integrated circuit package modules
    Subjects: “...Integrated circuits Computer simulation...”
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  15. 35
    Algorithms-based solution for multi-stage integrated circuit packaging scheduling problem
    by Yung-Hsuan Chen, 陳勇亘
    Published 2003
    “...碩士 === 國立交通大學 === 工業工程與管理系 === 91 === The integrated circuit packaging scheduling problem (ICPSP...”
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  16. 36
    Investigation of plastic package related failure mechanisms in plastic encapsulated integrated circuits
    by Troop, Nicholas Mark
    Published 1996
    Subjects: “...Circuits...”
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  17. 37
    An integrated software package for gate array selection.
    Published 1989
    Subjects: “...Gate array circuits...”
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    Others
  18. 38
    Thermo-mechanical modeling and design of micro-springs for microelectronic probing and packaging
    by Haemer, Joseph Michael
    Published 2007
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  19. 39
    Design and development of stress-engineered compliant interconnect in microelectronic packaging
    by Ma, Lunyu
    Published 2007
    Subjects: “...Interconnects (Integrated circuit technology) Design and construction...”
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  20. 40
    Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices
    by Michaelides, Stylianos
    Published 2007
    Subjects: “...Integrated circuits Reliability...”
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