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Showing 201 - 220 results of 1,507 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.57s Refine Results
  1. 201
    Prolonged silicon carbide integrated circuit operation in Venus surface atmospheric conditions
    “...The prolonged operation of semiconductor integrated circuits (ICs) needed for long-duration...”
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    Article
  2. 202
    Integrated antennas on organic packages and cavity filters for millimeter-wave and microwave communications systems
    by Amadjikpe, Arnaud Lucres
    Published 2012
    Subjects: “...Packaging...”
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  3. 203
    MONITORING OF IC ENCAPSULATION PROCESS
    Subjects: “...integrated circuits...”
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    Article
  4. 204
    High-Reliability and Low-Capacitance Bond Pad Design for CMOS Integrated Circuits
    by Peng, Jeng-Jie, 彭政傑
    Published 2002
    “...碩士 === 國立交通大學 === 電資學院學程碩士班 === 90 === Wire bond package is still the mainstream of IC packages...”
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  5. 205
    Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits
    Subjects: “...integrated circuits...”
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    Article
  6. 206
    Modeling and Evaluating Lead-frame CSPs for Radio-Frequency Integrated Circuit Applications
    by Hui-Hsiang Huang, 黃輝祥
    Published 2001
    “... chip carrier(BCC) packages. In the simulation, the Ansoft HFSS simulator was used to calculate...”
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  7. 207
    Analysis and applications of layered multiconductor coupled slot and strip-slot structures
    by Luo, Sifen
    Published 2013
    Subjects: “...Microwave integrated circuits...”
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  8. 208
    PCSIM: a parallel simulation environment for neural circuits fully integrated with Python
    by Dejan Pecevski, Thomas Natschläger, Klaus Schuch
    Published 2009-05-01
    “...The Parallel Circuit SIMulator (PCSIM) is a software package for simulation of neural circuits...”
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    Article
  9. 209
    Energy efficient active cooling of integrated circuits using embedded thermoelectric devices
    “.... The feasibility of the integration of the TEM and the automated mode switching within the microprocessor package...”
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  10. 210
    An Ultra-Wideband Compact TR Module Based on 3-D Packaging
    by Zhiqiang Li, Houjun Sun, Hongjiang Wu, Shuai Zhang
    Published 2021-06-01
    Subjects: “...3-D integrated packaging...”
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    Article
  11. 211
    Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications
    by Jiang, Hongjin
    Published 2008
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  12. 212
    QFN-Packaged Bandpass Filter With Intertwined Circular Spiral Inductor and Integrated Center-Located Capacitors Using Integrated Passive Device Technology
    Subjects: “...integrated passive device...”
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    Article
  13. 213
    Investigating the Temperature Effect of Reliability on Integration IC 3D Packaging under Drop Test
    by chen, hao chih, 陳顥之
    Published 2013
    “...., three-dimensional integrated circuit package. The main advantages of three-dimensional integrated...”
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  14. 214
    Tungsten Probe Measuring System of Unpackaged Integration Circuit Chip and Related Process Technology
    by Jin-Yea Wang, 王敬業
    Published 2000
    “... to the more and more small, modern wafer level packaging has to be developed. This technology cost much more...”
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  15. 215
    Preliminary Study on the Integration of Equipment Automation and Intelligent System in Semiconductor Packaging and Measurement Manufacturing Industry
    by TSUO-YU HSU, 許作宇
    Published 2019
    “...碩士 === 國立臺灣科技大學 === 管理研究所 === 107 === The application of integrated circuits is very extensive...”
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  16. 216
    Design and Development of Monolithic Microwave Integrated Amplifiers and Coupling Circuits for Telecommunication Systems Applications
    by R. Makri, M. Gargalakos, N. K. Uzunoglu
    Published 2002-01-01
    “...Recent advances in printed circuit and packaging technology of microwave and millimeter wave...”
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    Article
  17. 217
    Vector Finite Element Optimisation Of Compact Spot-size Converters In Photonics Integrated Circuits
    by Ladele, Emmanuel Olufemi
    Published 2006
    “... have been made to close the gap and reduce such a high loss when coupling a photonic integrated circuit...”
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  18. 218
    Electrical and fluidic interconnect design and technology for 3D ICS
    by Zaveri, Jesal
    Published 2011
    Subjects: “...Three-dimensional integrated circuits...”
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  19. 219
    Thermo-Mechanical Reliability of Micro-Interconnects in Three-Dimensional Integrated Circuits: Modeling and Simulation
    by Rodriguez, Omar
    Published 2010
    Subjects: “...Integrated Circuits...”
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  20. 220
    The Dual Use of Power Distribution Networks for Data Communications in High Speed Integrated Circuits
    by Chung, Woo Cheol
    Published 2014
    Subjects: “...Integrated Circuits...”
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