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161“... fabrication conceptual plant [1998]. Wu also illustrated several features about the modular-based IC...”
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162“... and micro-sensor, we implement our infrared micro-sensor directly fabricated on the top of IC. Achieving...”
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163“... converter ICs for cellular phone applications. In cellular phones, the load current demanded by the on-board...”
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164“... generators employing fundamental cells fabricated on a single integrated circuit (IC) package. Two solutions...”
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166“... by advanced fabrication technology and circuit design. The demands in low power...”
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167“... to be replaced by 3D stacking. 3D integrated circuits (3D-ICs) is expected to be more mainstream in the following...”
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168“... the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion...”
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169“... into different phases: IC design, wafer fabrication, wafer testing, packaging (assembly) and final test. IC...”
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170“...碩士 === 國立成功大學 === 工程科學系專班 === 98 === The manufacturing of an IC electronic device goes through...”
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171“... greatly. These ESD protection circuits are designed by the computer-aided IC layout software...”
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173“... design which includes a comparator, a signal generator, and a LED driver. The designed circuit has been...”
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175“... by the process variation of components has become a very important issue. This thesis proposes two IC designs...”
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176by Saha, Tanmoy“... budget (≤ 300 ○C), as well as material and chemical compatibility with IC fabrication, allowing...”
Published 2013
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177“... of this thesis is as followed: 1.The firms of design in the upstream of IC industry spontaneously...”
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178“... of IC fabrication system. We propose a new flow-control technique called "the interval-smoothness- short...”
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179“... explained how IC price and performance affect the IC fabrication process development. This includes...”
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180“... damage an IC and lower the yield rate. Many parameters will affect the mold adhesion force. However...”
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