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141“... after few decades. IC industry includes IC design, wafer fabrication, IC package , IC test and assembly...”
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142“... reduce the power consumption and without affect the performance for designing the IC by the Multiple...”
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143“..., the low voltage and low power circuits would be the trend for current CMOS IC design. Pulse-Width...”
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144by Kwon, Dongwon“... energy transducers. The presented research objective is to develop, design, simulate, fabricate...”
Published 2013
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145by Kwon, Dongwon“... energy transducers. The presented research objective is to develop, design, simulate, fabricate...”
Published 2015
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148“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 91 === In IC packaging, when epoxy molding compound(EMC)is filling...”
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149“...碩士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === The purpose of this thesis is to develop and fabricate a...”
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150“...碩士 === 國立雲林科技大學 === 機械工程系 === 108 === In this study, this work is mainly to design and fabricate...”
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152“... of integrated circuits (ICs) fabrication. Multiplicity enables the devices to be mass produced in thousands...”
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155by Maxey, Christopher AllenSubjects: “...fabrication...”
Published 2011
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156“...-and-fast functions are always the design and fabrication goals. Therefore, the required I/O pin number...”
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157“... issues in novel circuit designs. According to the ITRS’03 report, test cost will never decrease...”
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159“... of sockets has been designed and fabricated for testing advanced BGA packaging. The socket can be custom...”
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160“.... In this thesis, PRF stimulator and probeless IC Testing System are fabricated by TSMC 0.18 um 1P6M CMOS...”
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