Suggested Topics within your search.
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TJ Mechanical engineering and machinery
14
Technology: general issues
9
Solder
7
Soldering
7
History of engineering and technology
6
Binary alloys
5
Lead-free solders
5
Silver alloys
5
Tin alloys
5
Copper alloys
4
Intermetallic
4
LEAD-FREE SOLDERS
4
Scanning electron microscopy
4
SnAgCu
4
GROWTH
3
Graphene
3
Intermetallic compounds
3
Printed circuit boards
3
STRENGTH
3
Solder joints
3
TJ1-1570 Mechanical engineering and machinery
3
solder joint
3
BI
2
COMPOUND
2
Composite solders
2
Composites
2
Costs
2
Cu-Sn
2
Cu-Zn
2
Deformation
2
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21by Zhihuan Zhao, Guanghao Gong, Mingming Jiang, Chuanzhong Chen, Yingyue Pan, Weili Liu, Li ZhangSubjects: “...soldering temperature...”
Published 2020-01-01
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24by Reuse, Rolando.“...Solder joints provide both electrical and mechanical interconnections between a silicon chip...”
Published 2012
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25“... are soldered to form a joint, Sn/Ni and Sn/Cu interfacial reactions would interact mutually, as reviewed...”
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27“... machining as means of edge preparing for brazing and soldering. Among methods of foam mechanical and weld...”
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28by Sebastian Weis, Vasilii Fedorov, Michael Elssner, Thomas Uhlig, Susann Hausner, Guntram Wagner, Bernhard WielageSubjects: “...soldering...”
Published 2017-07-01
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31“... to 1250c , the solder bump exhibits plastic strain behavior .The fatigue life is predicted by the Coffin...”
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34“... J (SOJ) leads and Sn-37Pb solder were investigated. The thickness of the IMC layer formed initially...”
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35“... photoresist used as a solder mask in printed circuit board that has the good developable property, resolution...”
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36“...碩士 === 雲林科技大學 === 機械工程系碩士班 === 98 === In this study, the lead-free solders Sn3Ag0.5Cu with four...”
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38“...碩士 === 元智大學 === 電機工程學系 === 99 === The fluxless solder reflow has attracted great attention...”
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39by Pavão, Erica Medeiros“... superconductor would be needed for the current pending design of this switch. A superconducting solder with a...”
Published 2008
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40by Hogan, Patrick AlanSubjects: “...die soldering...”
Published 2008
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