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TK Electrical engineering. Electronics Nuclear engineering
21
Printed circuit boards
10
Technology: general issues
7
History of engineering and technology
4
Baculovirus
3
Biosensors
3
Capacitive sensor
3
Electrodes
3
Flexible PCB
3
Printed circuit boards (PCB)
3
QA75 Electronic computers. Computer science
3
Research & information: general
3
TA Engineering (General). Civil engineering (General)
3
Timing circuits
3
Bandwidth
2
Conductive 3D printing
2
Curved Layer Fused Deposition Modeling
2
Gold
2
Printed Circuit Board (PCB)
2
Printed circuit board
2
Probes
2
Resonance frequencies
2
Substrate integrated waveguides
2
electrode
2
'Dry' [
1
Accelerometers
1
Acoustic application
1
Acoustic resonators
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Acoustics
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Additive Manufacturing
1
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141“... response prediction of the printed circuit boards (PCB) for environmental vibration testing. This work...”
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142by Tzu-chi Hsu, 徐梓淇“...碩士 === 元智大學 === 工業工程與管理學系 === 103 === Production process of Printed circuit boards PCBs contains...”
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143by Alvi, Mohammed Imtiaz“...This research deals with the development of a dynamic job quotation system for printed circuit...”
Published 2000
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144“...碩士 === 國立臺灣大學 === 環境工程學研究所 === 104 === The concentration of gold in waste printed circuit board...”
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145“...博士 === 元智大學 === 工業工程與管理學系 === 91 === The placement of printed circuit boards with surface mount...”
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146“...博士 === 國立成功大學 === 電機工程學系碩博士班 === 93 === Bare PCB (Printed Circuit Board) may have defects...”
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147“...碩士 === 元智大學 === 化學工程學系 === 90 === Printed circuit board (PCB) manufacturing process consumes a...”
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150by Sarathy, Vasanth“.... As a first case,printed circuit board (PCB) insulation was selected as a target for investigation...”
Published 2006
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153“... a standard multilayer printed circuit board (PCB) technology. A 14-way power combiner with a two...”
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157by Suthiwongsunthorn, NathapongSubjects: “...Printed circuit board...”
Published 2002
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159“... Circuit Board) circuit of the three commonly used industry ability to inhibit the electrostatic protection...”
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160“...-etching method to examine the defects of via in the Printed Circuit Board. The preparation of micro...”
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