Suggested Topics within your search.
Suggested Topics within your search.
Photoresists
7
Laser beams
3
Gray scale
2
Microstructure
2
3D microstructures
1
Acrylics
1
Aqua Regia
1
Aqua regia
1
Bacteria
1
Beam system
1
Blood
1
Contact position
1
Contrast curve
1
Curve fitting
1
Curve shape
1
Cutting edges
1
Differential scanning calorimetry
1
Diffraction
1
Diffraction intensity
1
Diffusion
1
Direct write lithography
1
Direct-write lithography
1
Electrodes
1
Electromotive force
1
Emulsification
1
Expensive equipments
1
Exposure correction
1
Fabrication
1
Feature sizes
1
Figure of merit
1
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941“... is especially important for depositing on the wafer that is defined by the tiny pattern with photoresist. Our...”
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942“... lithography. The patterns is written in the photoresist AZ-5214 or SU-8 using a He-Cd laser of wavelength 325...”
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943“.... For dry-etching, we made a deeper PSS structures by different hard masks such as photoresist reflow...”
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944“... are introduced, including using thick photoresist as insulator to make periodically poled structure, and using...”
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945“...) Spinning upon photoresist on Si wafer and defining 200nm line width by deep UV aligner. We get periodic...”
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946“... for the external transmission circuit. At the least, a PI photoresist is used for the fixed seal. The resistance...”
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947“... and wet treatments to improve the dielectric properties of porous silica after photoresist stripping...”
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948“... was integrated using a dry film photoresist in conjunction with photolithographic and hot roll lamination...”
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949by Yu-Sheng Liu, 呂育昇“... which spin-coating by SU-8 2050 photoresist on the glass substrate and solidified by exposing to UV...”
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950by Jyun-Guei Huang, 黃俊貴“... with variable focus liquid lens module, and using lithography to fabricate photoresist mold. Then,to deposit...”
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951“... the photoresist as scarification. Finally, we release scarification to finish. ...”
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952“..., design of photomask, photoresist, development, etching and processing by electric discharge are studied...”
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953“.... The process parameters of photolithography including spin coating of the photoresist and the influence...”
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954“... composites were investigated. As a photoresist and a protective coating, the silica-polyimide nanocomposite...”
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955“...-order diffraction efficiency. The mask is used to produce a photoresist pattern with halved period...”
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956“... in the micromixer. To fabricate the micromixer, first we coat the SU-8 photoresist on a silicon wafer and explosure...”
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957“.... The peak-like residue which consists of metal and photoresist is found at the interface between electrode...”
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958“... non-patterned or patterned SU8 photoresist films coated on patterned ITO films. When SU8 films achieve...”
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959“.... The aluminum split structure is thermal insulated from the substrate by a SU-8 photoresist layer. The high...”
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960“... was derived. Further analyses of film properties after exposure and the capabilities as photoresist utilized...”
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