Suggested Topics within your search.
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History of engineering and technology
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Technology: general issues
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Intermetallics
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Solder
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4381by Trevizan, João Pedro Gonçalves“... characteristics, such as bond pull force and bond shear strenght, intermetallic compound and bonding pad structure...”
Published 2016
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4382by Philippe, Bertrand“... investigated as well as the interfacial reactions occurring upon the first cycle of an intermetallic compound...”
Published 2013
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4383
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4384by Schäfer, Jonathan“... intermetallic grains into the microstructure. Thus, the deformation is restricted to processes in the grain...”
Published 2013
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4385
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4386by Katia Cristiane Gandolpho Candioto“... HV a 1207 HV. === Materials with intermetallic phases have been evaluated for structural...”
Published 2009
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4387by Andrade, Protasio Nery“.... As Cu content was increased, hardness also increased due to Ti2Cu intermetallic compound precipitation...”
Published 2006
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4388by Lorena Braga Moura“... and phase precipitation. The intermetallic phases are obstacle to the grain growth of ferritic matrix...”
Published 2010
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4389by Ramirez, Bruna Niccoli“... of intermetallic (Fe28Al, Fe28Al6Cr and Fe28Al6Cr1Ti) were investigated under the influence of different...”
Published 2019
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4390“... materials (tube) diffused and the wider the intermetallic compound formed among the interfaces. After heated...”
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4391by Kasonde, Maweja.“... of the intermetallic compounds and the solid solutions formed were dependent on the milling conditions...”
Published 2012
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4392“... intermetallic compounds, also called Heusler alloys, began to attract attention when Germany chemist Friedrich...”
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4393by Førde, Thomas“... and growth or diffusion mechanisms are the rate limiting steps in the interaction of the intermetallic alloy...”
Published 2007
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Doctoral Thesis -
4394by Makongo Mangan, Julien Pierre Amelie“... intermetallische Verbindungen (engl.: complex intermetallic alloys, CMAs). CMAs sind charakterisiert durch (i...”
Published 2009
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Doctoral Thesis -
4395“... to investigate the IMC (intermetallic compound) evolution on (Sn-xZn)/Au, (Sn-9Zn)+xCu/Au and (Sn-9Zn)+xCu/Ni...”
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4396“... interlayer deposited by CAIP technique. It is also found that the FeTi and Fe2Ti intermetallic compounds were...”
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4397“... and thermomechanical fatigue (TMF) on the formation and growth of intermetallic compounds (IMCs) between Small Outline...”
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4398“... not maintain with increasing reflow times. On the other hand, the intermetallic growth kinetics of solid/solid...”
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4399“...=10,12,15,16) intermetallic alloy. The microstructure of the as-cast Ti-40Al-10Nb alloy consists of dense...”
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4400“...博士 === 國立清華大學 === 材料科學工程學系 === 94 === Two kinds of metal hydride system: LmNi5-based intermetallic...”
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