Suggested Topics within your search.
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History of engineering and technology
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TJ Mechanical engineering and machinery
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Technology: general issues
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Intermetallics
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Binary alloys
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Solder
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Industrial chemistry and chemical engineering
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Research & information: general
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SnAgCu
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Grain boundaries
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4021“... to the formation of intermetallic compounds (IMCs) throughout the entire joint area due to the limited volume...”
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4022“..., the intermetallic compounds (IMCs) formed from Cu pillar side to Ni side were Cu pillar/(Cu,Ni)6(Sn,In)5 /?? Ni...”
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4023“... joints mainly generated on Intermetallic Compound (IMC) and around the four corners, distributed from...”
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4024“... reflowed under a temperature gradient. After reflow, there was asymmetrical intermetallic compounds (IMCs...”
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4025“... be the central point of the system. The wettability of the IMC(Intermetallic compound)formation between...”
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4026“... the evolution of intermetallic compounds (IMCs) at the interface and the diffusion barrier capability...”
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4027“... and substrate will grows brittle intermetallic compound (IMCs) at the interface. Because it has different...”
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4028by Shih-chi Liu, 劉士齊“... at the surface. During reflow of Sn8.5Zn0.5Ag0.01Al0.1Ga on Au/Ni/Cu, AuZn3 and AgZn3 intermetallic compounds...”
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4029“... the IMC (intermetallic compound) growth behavior. Both compressive and tensile stresses can accelerate...”
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4030“... an intermetallic compound layer in the middle of the contact area. The compound layer does not form until a period...”
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4031“... of microbumps. It is well known that the diffusion is the key factor for intermetallic compounds (IMCs...”
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4032“... ranges from 10 to 60 μm. We observe the microstructure of the intermetallic compounds (IMCs) growth...”
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4033
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4034by Hemsworth, Brian“... with the cracking theories. Bead on plate tests carried out on a more complex alloy, A286 (a 25Ni 15Cr intermetallic...”
Published 1970
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4035“... thicknesses of two intermetallic compounds which one is Cu6Sn5 and the other is Cu3Sn form in Sn-Ag-Cu-Pb / Cu...”
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4036“... at equilibrium, elastic constants of pure Zr, Ti, Si, the binary intermetallic compound structures...”
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4037by Colley, Leo John“... liquid films in the alloy. EDX analysis confirmed that the liquid films consist of melted intermetallic...”
Published 2009
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4038“... for studying the interface reaction of Cu/Sn joint and the formation of intermetallic compounds (IMCs...”
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4039“... each melting point. To investigate the intermetallic compounds (IMCs) and phase formation in diffusion...”
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4040“... multiple reflows shown that, there are no intermetallic compound (IMC) found at Bi-2.5Ag and Bi-2.5Ag-1.0...”
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