Suggested Topics within your search.
Suggested Topics within your search.
History of engineering and technology
28
TJ Mechanical engineering and machinery
23
Technology: general issues
23
Intermetallics
11
Binary alloys
9
Materials science
7
Chemistry
6
Solder
6
Intermetallic
5
Ternary alloys
5
Titanium alloys
5
Aluminum alloys
4
Industrial chemistry and chemical engineering
4
Intermetallics compounds
4
LEAD-FREE SOLDERS
4
Research & information: general
4
SnAgCu
4
Chromium alloys
3
Copper alloys
3
GROWTH
3
Grain boundaries
3
Grain refinement
3
Graphene
3
Intermetallic compounds
3
Magnesium alloys
3
Metals technology / metallurgy
3
Microstructure
3
Nanoindentation
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Physics
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Rare earths
3
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3861by 宋韋奇“... to measure the diameter of the interfacial Cu6Sn5 intermetallic compounds (IMCs) after the selective removal...”
Published 2011
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3862“.... This will change the Cu concentration in solder, and consequently the equilibrium intermetallic at the interface...”
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3863“... alloy soldering. For alumina and copper soldering, the large particles of Cu6Sn5 and Cu3Sn intermetallic...”
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3864“... in the current crowding region and propagation at interface between solders and intermetallic compound, finally...”
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3865by 徐煒能“... of intermetallic compounds (IMC) and severe consumption of Cu substrate occurred at hot end whereas accumulation...”
Published 2014
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3866
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3867“... of intermetallic compounds (IMCs) increased with the time of thermal treatment at 250 ℃. When the time exceeded 2...”
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3868“..., proeutectic Bi and eutectic Bi-Ag. Without forming intermetallic compounds (IMC), the molten solder grooved...”
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3869“... indicated that annealing induced the nickel diffusion to blockage layer and fromed intermetallic compound...”
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3870“...) and energy dispersive spectroscopy (EDS) revealed that the layer-like intermetallic compound (IMC) is mainly...”
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3871“... of intermetallic compounds (IMCs) at Co-P/solder interface increased with the time of thermal treatment. However...”
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3872“... temperatures induced various intermetallic compound. The experimental results were studies by thermodynamic...”
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3873“... in order to clarify the effects of different minor addition elements on growths of intermetallic compounds...”
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3874“...-Ni d hybridization effects in the intermetallic Ni3Al (Ni3Ga) alloy using the Ni L3,2- and K-edge...”
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3875“... the intermetallic compounds (IMCs) are brittle and thus not good for 3D integrated circuit (IC) reliability. While...”
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3876“... of the microstructure and interfacial IMC（Intermetallic Compound）layer by adding 0.01 and 0.05wt% Ni into Sn-1Ag-0.5Cu...”
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3877“...碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 97 === The formation of intermetallic compounds (IMCs) helps...”
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3878Published 2016“... the microstructures are much finer than that obtained in larger joints (BGA, C4). The fraction of intermetallic...”
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Doctoral Thesis -
3879Published 2016“... such as the formation of intermetallic compounds due to interstitial diffusion and dissolution of underbump metallurgy...”
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Dissertation -
3880by Openshaw, Peter Raymond“..., of the intermetallic compounds UAl2, UAl3 and UAl4 have been studied using a microbalance and a thermal balance...”
Published 1962
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