Suggested Topics within your search.
Suggested Topics within your search.
History of engineering and technology
28
TJ Mechanical engineering and machinery
23
Technology: general issues
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Intermetallics
11
Binary alloys
9
Materials science
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Chemistry
6
Solder
6
Intermetallic
5
Ternary alloys
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Titanium alloys
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Aluminum alloys
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Industrial chemistry and chemical engineering
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Intermetallics compounds
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LEAD-FREE SOLDERS
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Research & information: general
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SnAgCu
4
Chromium alloys
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GROWTH
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Grain boundaries
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Grain refinement
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Graphene
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Intermetallic compounds
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Magnesium alloys
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Metals technology / metallurgy
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Microstructure
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Nanoindentation
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Physics
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Rare earths
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3841“... distributions such as δ-ferrite (delta-ferrite), austenite and other important intermetallic phases that may...”
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3842by Fry, Christopher“... of the intermetallic Mg2Ni in one of the samples was found to be beneficial for the hydrogenation kinetics, whilst...”
Published 2013
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3843by Colley, Leo John“... liquid films in the alloy. EDX analysis confirmed that the liquid films consist of melted intermetallic...”
Published 2009
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3844by Che, Hanqing“... was produced during the roll bonding process. There was no evidence of intermetallic formation at the interface...”
Published 2012
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3845“.... The coating was composed of ɤ-Ni solid solution, the Ni3Si eutectic structure, an intermetallic compound (Cr...”
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3846by Nugent, Peter John“...Quasicrystals are intermetallic alloys which exhibit long range order but lack periodicity. While...”
Published 2011
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3847“... of diffusion. By this reaction, one kind of intermetallic compound (IMC), Ni3Sn4 will occur at the interface...”
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3848“... in all three solders in soldering reactions with Ni plates. The formations of the intermetallic compounds...”
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3849“... content. However, intermetallic compound (IMC) likely formed in crystalline GST with Ce concentration...”
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3850“... showed that intermetallic compound of Mg-Sn was formed at the magnesium/filler interface, and after aging...”
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3851“... and interfaces between intermetallic compound and Sn matrix for the given Sn-3.5Ag-0.5Cu solder alloy. ...”
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3852“... intermetallic compound was observed in XRD results. The increase in resistivity caused...”
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3853“... steel in lead-free solder can be constructed that at the beginning, a intermetallic compound（IMC） layer...”
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3854“... the dissolution、wetting behavior、thermal property、mechanical property and Intermetallic Compound (IMC) of both Cu...”
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3855“... metallization (UBM) are of highly interests recently in flip chip technology. Intermetallic compounds (IMCs...”
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3856“... as protective coatings on glass molding dies. The formation of intermetallic compounds in the coatings inhibits...”
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3857by 吳俊毅“... formed in the interface of under-bump-metallization and intermetallic compounds. Besides, the joule...”
Published 2012
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3858“... portion of the intermetallic compounds （IMCs）. Many new issues must occur due to the reduction of solder...”
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3859“... of electromigration and thermomigration on the evolution of intermetallic compounds (IMCs) in the flip chip Cu/Sn2.4Ag...”
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3860“...碩士 === 國立清華大學 === 材料科學工程學系 === 101 === In electronic packaging, rapid growth of intermetallic...”
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