Suggested Topics within your search.
Suggested Topics within your search.
History of engineering and technology
28
TJ Mechanical engineering and machinery
23
Technology: general issues
23
Intermetallics
11
Binary alloys
9
Materials science
7
Chemistry
6
Solder
6
Intermetallic
5
Ternary alloys
5
Titanium alloys
5
Aluminum alloys
4
Industrial chemistry and chemical engineering
4
Intermetallics compounds
4
LEAD-FREE SOLDERS
4
Research & information: general
4
SnAgCu
4
Chromium alloys
3
Copper alloys
3
GROWTH
3
Grain boundaries
3
Grain refinement
3
Graphene
3
Intermetallic compounds
3
Magnesium alloys
3
Metals technology / metallurgy
3
Microstructure
3
Nanoindentation
3
Physics
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Rare earths
3
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3701by 吳峰誌“... reflowing, there existed Ni-Sn-In intermetallic compound (IMC) and their proportion was Ni : Sn : In = 33.5...”
Published 2002
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3702“.... An intermetallic compound layer was formed at the interface between solder and electroless nickel...”
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3703“... of an intermetallic phase in the alloys with high molybdenum contents. Hopkinson bar dynamic test under strain rates...”
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3704“...-ray diffraction pattern as Zr2Ni and Zr2(Cu,Al) intermetallic compounds. In contrast, BMG with Sc...”
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3705“...碩士 === 義守大學 === 材料科學與工程學系碩士班 === 98 === In order to understand the mechanism of intermetallic...”
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3706“.... The intermetallic compounds formed during reflow for solder bumps with electroless nickel or electroplated nickel...”
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3707by Heng-Sheng Hsieh, 謝恆昇“... are (1) the intermetallic layer induced interface stress, (2) the difference of thermal expansion...”
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3708“.... These phases of irregular shape were analyzed containing the Fe7W6 intermetallic compound and the Fe-Ni solid...”
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3709A Study of Electric Current Effect on the Reaction Between Liquid Tin-Lead Solders and Cu Thin Films“.... An asymmetric distribution of Pb precipitate and intermetallic compounds was observed in the precursor bands...”
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3710The Effect of Repeated Vacuum Brazing on the Microstructure and Mechanical Properties of Inconel 718by Hsiang-Lin Huang, 黃翔麟“... severely declined when there were brittle intermetallic compounds in the welds. When Vacuum Brazing process...”
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3711“...) and Printed Circuit Board (PCB) surface finishes on the intermetallic compounds (IMCs) growth to strengthen...”
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3712“... refinement due to the formation of primary Al3(Sc,Zr) intermetallic phase during solidification...”
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3713“... were used for predicting the metallic glass regions by combined the supressed intermetallic compounds...”
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3714“... analyzed. The results indicated that the growth of the intermetallic compound (IMC) was enhanced when...”
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3715by Ernsting, David“... experimental data, showing good agreement, and demonstrating the accuracy of our method. For the intermetallic...”
Published 2015
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3716“... size might induce: (1) a complete transformation of “solder” joints into “intermetallic compound (IMC...”
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3717“..., the solutes formed intermetallic compounds due to the negative mixing enthalpies and the low-to-medium mixing...”
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3718“... microbumps transformed into intermetallic compound (IMC) microbump. The fast dissolution of UBM and fast...”
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