A Novel Coupling Mechanism for CSRRs as Near-Field Dielectric Sensors

This work proposes a novel coupling mechanism for a complementary split-ring resonator as a planar near-field microwave sensor for dielectric materials. The resonator is etched into the ground plane of a microstrip line. This mechanism is based on the inductive coupling synthesized by utilizing a vi...

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Bibliographic Details
Main Author: Albishi, A.M (Author)
Format: Article
Language:English
Published: MDPI 2022
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Online Access:View Fulltext in Publisher
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Summary:This work proposes a novel coupling mechanism for a complementary split-ring resonator as a planar near-field microwave sensor for dielectric materials. The resonator is etched into the ground plane of a microstrip line. This mechanism is based on the inductive coupling synthesized by utilizing a via that connects the power plane of the microstrip line to the central island of the resonator. The proposed coupling makes the coupling capacitance between the transmission line and the resonator relatively small and insignificant compared to the capacitance of the resonator, making it more sensitive to changes in the dielectric constant of the materials under test. In addition, the coupling is no longer dependent solely on the capacitive coupling, which significantly reduces the coupling degradation caused by loading the resonator with dielectric materials, so the inductive coupling plays an important role in the proposed design. Therefore, the proposed coupling mechanism improves the sensitivity and enhances the coupling between the transmission line and the resonator. The sensor is evaluated for sensitivity, normalized resonance shift, and coupling factor using a full-wave numerical simulation. The sensitivity of the proposed sensor is 12% and 5.6% when detecting dielectric constants of 2 and 10, respectively. Compared to recent studies, the sensitivity improvement when detecting similar permittivity is 20% (1.32 times) and 9.8% (1.1 times). For verification, the proposed sensor is manufactured using PCB technology and is used to detect the presence of two dielectric laminates. © 2022 by the author. Licensee MDPI, Basel, Switzerland.
ISBN:14248220 (ISSN)
DOI:10.3390/s22093313