A new approach to studying the electrical behavior and the inhomogeneities of the Schottky barrier height

In this paper, two Schottky structures of Au/n-GaAs (sample A) and Au/0.8 nm-GaN/n-GaAs (sample B) were fabricated and electrically characterized by current–voltage measurements at different temperatures. Two models, a classical one and another previously proposed named Helal model ref (Helal et al....

Full description

Bibliographic Details
Main Authors: Benamara, Z. (Author), Comini, E. (Author), Dominguez, M. (Author), Helal, H. (Author), Kacha, A.H (Author), Khirouni, K. (Author), Monier, G. (Author), Rabehi, A. (Author), Robert-Goumet, C. (Author)
Format: Article
Language:English
Published: Springer Science and Business Media Deutschland GmbH 2022
Online Access:View Fulltext in Publisher
Description
Summary:In this paper, two Schottky structures of Au/n-GaAs (sample A) and Au/0.8 nm-GaN/n-GaAs (sample B) were fabricated and electrically characterized by current–voltage measurements at different temperatures. Two models, a classical one and another previously proposed named Helal model ref (Helal et al. Eur Phys J Plus, 135:1–14, 2020). Both the models show that the ideality factor n grows as the temperature decreases, and the second model shows higher values especially at low temperatures. The barrier height Φ b calculated using the second model decreases when temperature increases for both structures, according to the temperature-dependent band gap, and in contrast to the results obtained by the classical model. Moreover, the second model gives a homogeneous Schottky barrier height and the best resolution of Richardson constant A∗, for both structures. On the other hand, the classical model shows an inhomogeneity of the barrier height and very far values of A∗ from the theoretical one, in both structures. The findings of this study support the validity and dependability of the proposed alternative model. Furthermore, it may give a new insight into the electrical behavior of the Schottky structures. © 2022, The Author(s).
ISBN:21905444 (ISSN)
DOI:10.1140/epjp/s13360-022-02672-0