Arc erosion behaviour of in-situ TiB2/Cu composites with a three-dimensional network structure

Copper matrix composites (CMCs) with tailored heterogeneous structures at the mesoscopic scale are promising candidates for electrical contact materials. In this work, CMCs reinforced by an in situ formed three-dimensional network of TiB2 particles were synthesized from Cu, Ti and B powder mixtures...

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Bibliographic Details
Main Authors: Cai, L. (Author), Cao, F. (Author), Du, X. (Author), Han, F. (Author), Han, L. (Author), Jiang, Y. (Author), Xu, Y. (Author), Zhu, J. (Author)
Format: Article
Language:English
Published: IOP Publishing Ltd 2022
Subjects:
Online Access:View Fulltext in Publisher
LEADER 02559nam a2200505Ia 4500
001 10.1088-2053-1591-ac6091
008 220510s2022 CNT 000 0 und d
020 |a 20531591 (ISSN) 
245 1 0 |a Arc erosion behaviour of in-situ TiB2/Cu composites with a three-dimensional network structure 
260 0 |b IOP Publishing Ltd  |c 2022 
856 |z View Fulltext in Publisher  |u https://doi.org/10.1088/2053-1591/ac6091 
520 3 |a Copper matrix composites (CMCs) with tailored heterogeneous structures at the mesoscopic scale are promising candidates for electrical contact materials. In this work, CMCs reinforced by an in situ formed three-dimensional network of TiB2 particles were synthesized from Cu, Ti and B powder mixtures by reactive hot-pressing. The arc erosion behaviour of the fabricated CMCs was investigated by an electrical contact test. The distribution state of in situ TiB2 depends on the particle size of the Cu powder. The critical size for forming a continuous network in 3 wt%TiB2/Cu composites is estimated to be 24 μm. Once the continuous network is formed in CMCs, the arc energy and duration suddenly change to ultrasmall and stable values, and the erosion area and total mass loss after 5000 cycles of the contact test remarkably decrease. The results indicate that the CMCs reinforced by in situ networks of TiB2 particles exhibit excellent arc erosion resistance. © 2022 The Author(s). Published by IOP Publishing Ltd. 
650 0 4 |a 3D network structure 
650 0 4 |a 3D-network structures 
650 0 4 |a arc erosion 
650 0 4 |a Arc erosion 
650 0 4 |a Contact tests 
650 0 4 |a Copper 
650 0 4 |a Copper compounds 
650 0 4 |a Copper matrix composite 
650 0 4 |a copper matrix composites 
650 0 4 |a Electrical contact material 
650 0 4 |a Erosion 
650 0 4 |a Erosion behavior 
650 0 4 |a Fabrication 
650 0 4 |a Heterogeneous structures 
650 0 4 |a Hot pressing 
650 0 4 |a in-situ fabrication 
650 0 4 |a In-situ fabrication 
650 0 4 |a Mesoscopic scale 
650 0 4 |a Metallic matrix composites 
650 0 4 |a Particle reinforced composites 
650 0 4 |a Particle size 
650 0 4 |a Reinforcement 
650 0 4 |a Three dimensional network structure 
650 0 4 |a Titanium compounds 
700 1 |a Cai, L.  |e author 
700 1 |a Cao, F.  |e author 
700 1 |a Du, X.  |e author 
700 1 |a Han, F.  |e author 
700 1 |a Han, L.  |e author 
700 1 |a Jiang, Y.  |e author 
700 1 |a Xu, Y.  |e author 
700 1 |a Zhu, J.  |e author 
773 |t Materials Research Express